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Diamond Wafering Blades

EXTEC ® Low Concentration AC

AC (Advanced Ceramic), recommended for medium ceramics, GaAs, AIN, glass fiber composites, electron packages.

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C-K:
Fast, convenient and economical, the C-K (Clear-Kling) System uses a revolutionary clear backing that allows adhesion without adhesives. C-K discs can be applied to any platen. Select your desired C-K cloth, abrasive disc or diamond lapping film and apply to platen - it instantly adheres. When finished just lift and replace with the next item. C-K discs stay on the platen and may be used repeatedly. Available on a variety of Extec products.
PSA:
PSA (Pressure Sensitive Adhesive) backing that is oil, water & alcohol resistant.
Cloth:
Cloth backing is available for most products.
Plain:
Plain backing is available for most products.
Poly Back:
Extec Poly backing.
Maxima:
Non-metallic, magnetic compatible backing.
Organize Products By:
Catalog # Unit Diameter Thickness Arbor Application  
12190
Each 3.0"
(76.0 mm)
0.006"
(0.15 mm)
0.5"
(12.7 mm)
Recommended for medium ceramics, GaAs, AIN, glass fiber composites, electron packages  
12192
Each 4.0"
(102.0 mm)
0.012"
(0.3 mm)
0.5"
(12.7 mm)
Recommended for medium ceramics, GaAs, AIN, glass fiber composites, electron packages  
12194
Each 5.0"
(127.0 mm)
0.015"
(0.5 mm)
0.5"
(12.7 mm)
Recommended for medium ceramics, GaAs, AIN, glass fiber composites, electron packages  
12196
Each 7.0"
(178.0 mm)
0.02"
(0.6 mm)
0.5"
(12.7 mm)
Recommended for medium ceramics, GaAs, AIN, glass fiber composites, electron packages  
12198
Each 8.0"
(203.0 mm)
0.035"
(0.9 mm)
0.5"
(12.7 mm)
Recommended for medium ceramics, GaAs, AIN, glass fiber composites, electron packages  
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Pricing found on www.extec.com is U.S. only.