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Polishing Suspensions

EXTEC ® Colloidal Silica

Available in 0.06 µm and 0.02 µm particle size. Recommended for composites, silicon nitride, cobalt-based alloys, nickel-based alloys, steels, tool steels, electronics and printed circuit boards.

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C-K:
Fast, convenient and economical, the C-K (Clear-Kling) System uses a revolutionary clear backing that allows adhesion without adhesives. C-K discs can be applied to any platen. Select your desired C-K cloth, abrasive disc or diamond lapping film and apply to platen - it instantly adheres. When finished just lift and replace with the next item. C-K discs stay on the platen and may be used repeatedly. Available on a variety of Extec products.
PSA:
PSA (Pressure Sensitive Adhesive) backing that is oil, water & alcohol resistant.
Cloth:
Cloth backing is available for most products.
Plain:
Plain backing is available for most products.
Poly Back:
Extec Poly backing.
Maxima:
Non-metallic, magnetic compatible backing.
Organize Products By:
Catalog # Unit Micron
Size
Description  
16788
6 oz (150 ml) 0.06µColloidal Silica
16790
64 oz (1.9 l) 0.06µColloidal Silica
16792
6 oz (150 ml) 0.02µColloidal Silica
16794
64 oz (1.9 l) 0.02µColloidal Silica
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Pricing found on www.extec.com is U.S. only.